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1 publication date: november 2010 ver. aeb data sheet part no. package code no. AN26112A ulga006-f-1517
AN26112A 2 ver. aeb contents ? overview ????????????????????.????????????????????? 3 ? features ???????????????????.?????????????????????? 3 ? applications ???????????????????.????????????????????? 3 ? package ???????????????????.??????????????????????. 3 ? type ?????????????????????.??????????????????????. 3 ? application circuit example (block diagram) ????.?????????????????????? 4 ? pin descriptions ????????????????.?????????????????????? 5 ? absolute maximum ratings ????????????.????????????????????? 6 ? operating supply voltage range ????????.????????? ?????????????? 6 ? allowable voltage range ???? ???????????? ???????????? ??????? 7 ? electrical characteristics ?????.????????????????????????????? 8 ? control pin mode table ???? ??????.??????????? ?????????????? 10 ? truth table ??????????????????.??????????????????????. 10 ? technical data ????????????????.??????????????????????? 11 y i/o block circuit diagrams and pin function descriptions ???????????? ???????? 11 y p d ? t a diagram ?????????????????????????????????????. 12 ? usage notes ????????????????. ????????????? ??????????. 13
AN26112A 3 ver. aeb AN26112A vhf/uhf amplifier ic with path through mode for tv applications ? overview y AN26112A is a vhf/uhf amplifie r ic (40 mhz to 900 mhz) y realizing high performance by using 0.30 m bi-cmos process (ft = 20 ghz, fmax = 20 ghz). y achieving miniaturization by using small size package. ? features y with path through mode y operation voltage +3.30 v typ. y current consumption 68 ma typ. y gain high gain 12.5 db typ. frx = 450 mhz, z 0 = 50 path through ?2.0 db typ. frx = 450 mhz, z 0 = 50 y noise figure high gain 3.0 db typ. frx = 450 mhz, z 0 = 50 y distortion (iip3) high gain 12.0 dbm typ. frx = 450 mhz, z 0 = 50 y small package (6 pin plastic package with heat sink). ? applications y vhf /uhf applications ? package y 6 pin fine pitch land grid array package (lga type) size : 1.52 mm 1.72 mm 0.40 mm ? type y bi?cmos ic
AN26112A 4 ver. aeb ? application circuit example (block diagram) notes) y this application circuit is an example. the operation of mass production set is not guaranteed. perform enough evaluation and verif ication on the design of mass production set. y this block diagram is for explaining functions. the part of the block diagram may be omitte d, or it may be simplified. port1 (rfin) 12 cnt v ss 3 c1 pt_out cnt rf_in c3 v dd 4 6 amp_out v dd 5 c4 c2 logic l1 port2 (ampout) port3 (ptout)
AN26112A 5 ver. aeb ? pin descriptions rf input input rf_in 1 v ss ground v ss 2 amp rf output output pt_out 4 v dd power supply v dd 5 path through output output amp_out 6 high gain / path through mode control input cnt 3 description type pin name pin no.
AN26112A 6 ver. aeb ? absolute maximum ratings ? ma 95 i dd supply current 2 notes unit rating symbol parameter a no. *3 c ?40 to +150 t stg storage temperature 5 *3 c ?20 to +80 t opr operating ambient temperature 4 *2 mw 83 p d power dissipation 3 *1 v 3.6 v dd supply voltage 1 notes) *1 : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : the power dissipation shown is the value at t a = 80 c for the independent (unmounted) ic package without a heat sink. when using this ic, refer to ? p d -t a diagram in the ? technical data standard and design the heat ra diation with sufficient margin so that the allowable value might not be exceeded based on the conditi ons of power supply voltage, load, and ambient temperature. *3 : except for the power dissipation, operating ambient temp erature, and storage temperature, all ratings are for t a = 25 c. ? operating supply voltage range supply voltage range *1 notes unit range symbol parameter v 3.13 to 3.47 v dd note) *1 : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. note) absolute maximum ratings are limit values which do not resu lt in damages to this ic, and ic operation is not guaranteed at t hese limit values.
AN26112A 7 ver. aeb ? allowable voltage range notes) y allowable current and voltage ranges are limit ranges which do no t result in damages to this ic, and ic operation is not guaran teed within these limit ranges. y do not apply voltage to n.c. pins. y voltage values are with respect to the gnd. y applying external voltage to any pin not mentioned below l eads to the malfunction and the damage of the device. y below ratings are specified for prevention of malf unction and stress, not for guaranteed operation. notes) *1 : rf signal input pin (maximum input power is tbd). do not apply dc current. *2 : rf signal output pin. *3 : v dd + 0.3 v must not be exceeded 3.6 v. *3 v ?0.3 to (v dd + 0.3) cnt 3 *2,3 v ?0.3 to (v dd + 0.3) pt_out 4 *2,3 v ?0.3 to (v dd + 0.3) amp_out 6 ? rf_in notes unit rating pin name pin no. *1 v 1
AN26112A 8 ver. aeb ? ma 85 68 ? v dd current at high-gain mode no input signal i dd h supply current hg dc-1 ? a 60 0.2 ? v dd current at path through mode no input signal i dd p supply current pt dc-2 ? v ? 3.30 2.81 vih = v dd 0.85 vih sw voltage (high-gain mode) dc-3 ? v 0.33 0.0 ? vih = v dd 0.10 vil sw voltage (path through mode) dc-4 ? a 10 3.3 ? current at cnt pin vih = v dd iih sw current (high) dc-5 dc electrical characteristics limits typ unit max notes min conditions symbol parameter b no. ? electrical characteristics at v dd = 3.30 v note) t a = 25 c 2 c unless otherwise specified.
AN26112A 9 ver. aeb ? db ?0.8 ?2.0 ?3.0 power gain at path through mode f = frx gps power gain path through a-2 ? db 14.5 12.5 10.5 power gain at high gain mode f = frx ghs power gain high gain a-1 ? dbm ? 12.0 9.0 iip3 at high gain mode f1 = 450 mhz f2 = 460 mhz input 2 signals (f1, f2) iip3hs iip3 10 mhz offset high gain a-3 ac electrical characteristics limits typ unit max notes min conditions symbol parameter b no. ? electrical characteristics (continued) at v dd = 3.30 v note) t a = 25 c 2 c, frx = 450 mhz, prx = ?15 dbm, z 0 = 50 , cw unless otherwise specified.
AN26112A 10 ver. aeb ? control pin mode table note) control voltage range : see b no . dc-3 / b no. dc-4 at page 8 pin voltage high-gain high ? path through high-gain/path through switching (gain control) 3 remarks low description pin no. high-gain high-gain high mode lna cnt path through path through low ? truth table note) control voltage range : see b no . dc-3 / b no. dc-4 at page 8
AN26112A 11 ver. aeb ? technical data y i/o block circuit diagrams and pin function descriptions note) the characteristics listed below are reference values derived from the design of the ic and are not guaranteed. power supply 3.3 v 5 gnd ? 0.0 v 2 high gain / path through mode control ? 3 path through output 0.0 v 4 amp output ? 6 rf input 0.75 v 1 descriptions internal circuit voltage pin no. 1 v dd v ss 5 v ss 6 v ss 4 v dd v ss gnd 3
AN26112A 12 ver. aeb ? technical data y p d ? t a diagram
AN26112A 13 ver. aeb y special attention and precaution in using 1. this ic is intended to be used for general electronic equipment [tv]. consult our sales staff in advance for in formation on the foll owing applications: x special applications in which ex ceptional quality and reli ability are required, or if the fail ure or malfunction of this ic may directly jeopardize life or harm the human body. x any applications other than the standard applications intended. (1) space appliance (such as artificial satellite, and rocket) (2) traffic control equipment (such as fo r automobile, airplane, train, and ship) (3) medical equipment for life support (4) submarine transponder (5) control equipment for power plant (6) disaster prevention and security device (7) weapon (8) others : applications of which reliability equivalent to (1) to (7) is required it is to be understood that our company shall not be held respons ible for any damage incurred as a result of or in connection w ith your using the ic described in this book for any special applicatio n, unless our company agrees to your using the ic in this bo ok for any special application. 2. pay attention to the direction of lsi. when mounting it in the wrong direction onto the pcb (printed-circuit-board), it might smoke or ignite. 3. pay attention in the pcb (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. in addition, refer to the pin description for the pin configuration. 4. perform a visual inspection on the pcb be fore applying power, otherwise damage might happen due to problems such as a solder- bridge between the pins of the semiconductor device. also, perfo rm a full technical verification on the assembly quality, becau se the same damage possibly can happen due to conductive substanc es, such as solder ball, that adhere to the lsi during transportation. 5. take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin- v cc short (power supply fault), output pin-gnd short (ground fault), or output-to-output-pin short (load short) . and, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage a nd operating environment etc.). esp ecially, please be careful not to exceed the range of absolu te maximum rating on the transient state, such as power-on, power-off and mode -switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, ta ke into the consideration of incidence of break down and failur e mode, possible to occur to semiconductor produc ts. measures on the system s such as redundant design, arresting the spread of fi re or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the produ cts. 7. when using the lsi for new models, verify the safe ty including the long-term reliability for each product. 8. when the application system is designed by using this lsi, be sure to confirm notes in this book. be sure to read the notes to descriptions and the usage notes in the book. ? usage notes
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202

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